| PART |
Description |
Maker |
| WLP200 |
WAFER LEVEL PACKAGE EVALUATION RC FILTER NETWORK
|
California Micro Devices Corp
|
| VMMK-2203 |
0.9-11 GHz E-pHEMT Wideband Amplifier in Wafer Level Package
|
Broadcom Corporation.
AVAGO TECHNOLOGIES LIMI...
|
| 27C010RPFI-30 27C010RPFC-25 27C010RPFB-30 27C010RP |
x8 EPROM
Evaluation Kit for the MAX3741
Evaluation Kit for the MAX3738
Evaluation Kit for the MAX3748A
Evaluation Kit for the MAX3740A
Evaluation Kit for the MAX3737
Evaluation Kit for the MAX3744, MAX3745 x8存储
Evaluation Kit for the MAX3747, MAX3747A x8存储
|
Atmel, Corp.
|
| 10-63-1039 10-63-1079 10-63-1049 |
5.08MM 3CKT KK WAFER ASSY 528503A 3 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
5.08SPOX ST FR/LC HDR 7CK 528507A
5.08MM 4CKT KK WAFER ASSY 528504A
|
Molex, Inc.
MOLEX INC
|
| EV42-160-22-SERIES EV44-100-22-SERIES EV44-160-22- |
TLC2555 Evaluation Module
TLC4545 Evaluation Module
TLC2551 Evaluation Module
CC1000DK-868/915 MHz Development Kit
CC2400DK Development Kit
TPA0172 Evaluation Module
Radiomodem 433 MHz
CC2400DBK Demonstration Board Kit
CC1000PP 433 MHz Plug and Play Module
Digital Data Capture and Analysis for High Speed, High Resolution A to D Converters
ADS1244 Evaluation Module
SN65HVD22EVM Evaluation Module
Peripheral IC 外围芯片
|
Infineon Technologies AG
NXP Semiconductors N.V.
Amphenol, Corp.
Xicon Passive Components
Electronic Theatre Controls, Inc.
|
| 2683-100410 2683-200240 2683-200410 2683-100240 26 |
Quadruple-Mode LNA/Mixer Evaluation Kits
MAX2582 Evaluation Kit
Evaluation Kit for the MAX2601, MAX2602
Interface IC
Quad-Band TDD-WCDMA RF-to-Bits Radio Receiver 接口IC
|
Teledyne Technologies, Inc.
|
| OPAMP3EVB |
Op Amp Evaluation Board Manual TSSOP-16 Package
|
ON Semiconductor
|
| AD7899 EVAL-AD7899CB |
Evaluation Board for 5V, 12-Bit, Serial 220kSPS ADC in 8-Pin Package
|
AD[Analog Devices]
|
| OPAMP1EVB |
Op Amp Evaluation Board Manual SOT23, SC70, and SOIC8 Package
|
ON Semiconductor
|
| PHP191NQ06LT PHB191NQ06LT |
Logic level N-channel enhancement mode field-effect transistor in a plastic package using TrenchMOS technology
PHP/PHB191NQ06LT; N-channel Trenchmos (tm) logic level FET
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| 262650 262647 259500 262656 262657 262643 259501 2 |
Evaluation Kit for the MAX1970, MAX1971, MAX1972
MAX19710–MAX19713 Evaluation Kits/Evaluation Systems
1%-Accurate, Digitally Trimmed, Rail-to-Rail Sensor Signal Conditioner
SIGN-PICTO OF PADL.&CHAIN
10-Bit, 22Msps, Full-Duplex, Analog Front-End 标志，保持防火门锁模
|
Maxim Integrated Products, Inc.
|
| MF1ICS2005W7D MF1ICS2005 MF1ICS2005U7D |
Sawn bumped 120レm wafer addendum
Sawn bumped 120μm wafer addendum
|
NXP Semiconductors N.V.
NXP[NXP Semiconductors]
|
